The Puma 9130 and 9150 Laser Imaging Inspectors combine UV illumination optics with multiple high speed imaging sensors to offera range of optical modes for critical defect detection inline on patterned, production wafers. The 91XX delivers high sampling rates,high throughput and high sensitivity enabling more effective capture and control of yield-impacting defects on critical front-end-of-line(FEOL) and back-end-of-line (BEOL) layers. The 91XX complements the KLA 2367 full-spectrum UV/visible brightfield inspector for a mixand-match patterned wafer inspection strategy
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